UDP

Black Colloid USB Flash Module/UDP

What is a Black Colloid USB Flash Module?

      The USB drive black resin body is the core integrated storage module of a USB drive. Simply put, it integrates the USB drive’s “brain” (control chip), ‘memory’ (flash memory chip), and “connection interface” (USB port) onto a small PCB substrate, then encapsulates the entire assembly with black epoxy resin to form an integrated component.
     It is not a complete USB drive but rather its “core functional unit,” equivalent to a “condensed version of the USB drive’s mainboard.” Once assembled into a casing, it becomes a finished USB drive.

   Solution: SMI Huirong / Anguo Alcor / Yixin / AS

USB 2.0/USB 3.0/3.1 Gen1 Black Colloid USB Flash Module

Based on the interface and length of USB flash drive connectors, they are primarily categorized into three types: USB 2.0 connectors, USB 3.0/3.1 Gen1 connectors, and Type-C connectors (including dual-interface types).

Free design, free samples ,contact us:info@yousanusb.com

Type-C Interface Black Plastic Body (Includes Dual Ports)

Type-C MUDP 2.0

The USB 2.0 TYPE-C UDP Flash Chip Mini is a compact,cost-effective host controller and flash memory solution tailored for USB Type-C storage devices.

Type-C MUDP 3.0

Type-C MUDP 3.0 Chip, Multi-device compatible USB drives, mini custom USB drives (such as keychain USB drives, ultra-thin card-style USB drives)

Type-C UDP 3.0(Andriod)

Type-C (Android interface), or “USB-A + Type-C dual interface”; Transfer Speed: Available in both USB 2.0 and 3.0 specifications; dual-interface models support both new and legacy devices

Type-C UDP 3.0

The Type C-USB 3.0 flash drive features a USB 3.0 interface, delivering read speeds of 120MB/s and write speeds of 40MB/s for stable and reliable performance.

Advantages of USB Flash Drive Black Colloid

1. The black colloid is a tightly integrated unit utilizing wafer packaging technology. It is waterproof, dustproof, shockproof, and withstands temperatures of 60-70°C. Its slim, lightweight design enables easy and straightforward product assembly. The standardized product facilitates further mold development by customers.


2. USB drive assembly requires only a UDP module (black colloid chip) + housing = USB drive.


3. The compact UDP module facilitates diverse housing designs with simple assembly requiring no soldering. This significantly boosts production volume and reduces manufacturing costs for black colloid USB drives.

Why choose YOUSAN USB Flash Drive Black Colloid?

1. Fast Transfer Speeds
Features premium flash memory chips for stable, consistent performance without slowdowns, delivering sustained high-speed transfers in real-world use.

2. Controller Solutions
Employs industry-leading controllers from NANDFLASH and Silicon Motion to ensure reliable quality and efficient performance.these black vinyl USB drives fully comply with H5 international testing standards.

3. Waterproof and Durable
Professionally tested to withstand rain exposure or accidental submersion—simply wipe dry with a paper towel and resume use.

Our Custom UDP Drives

Below are custom card-style USB drives featuring waterproof UDP technology, available in various custom designs. Primarily equipped with UDP 2.0 and USB 3.0 interfaces, these black vinyl USB drives fully comply with H5 international testing standards.

UDP for USB Flash Drive FAQ

The TLC chip within the USB drive’s black resin casing is a core storage module based on TLC flash memory technology, encapsulated in black epoxy resin.
TLC (Triple-Level Cell) is a flash memory storage technology where each cell stores 3 bits of data (across 8 distinct voltage states). Compared to SLC (1 bit) and MLC (2 bits), TLC offers higher storage density and lower cost, but exhibits relatively weaker endurance and slower speeds. Within the black resin casing, the TLC chip is integrated with the controller chip, USB interface, and other components onto a miniature PCB substrate. This integrated packaging forms a complete storage module that directly fits into various USB flash drive housings.

DimensionTLC Black Colloid USB Flash ModuleMLC Black Colloid USB Flash ModuleSLC Black Colloid USB Flash Module
Storage DensityHigh (3bit/cell, Triple-Level Cell)Medium (2bit/cell, Multi-Level Cell)Low (1bit/cell, Single-Level Cell)
CostLowestMediumHighest (about 3-5 times that of TLC)
Write/Erase Cycles500-3000 cycles3000-10000 cyclesOver 100,000 cycles
Read Speed80-150MB/s (USB 3.0)100-200MB/s (USB 3.0)Over 200MB/s (USB 3.0)
Typical ApplicationsGift USB flash drives, daily storageBusiness USB flash drives, industrial equipmentMilitary, medical and other high-reliability scenarios

MLC chip black resin is a USB drive core storage module based on MLC flash memory technology. It integrates MLC flash memory chips, controller chips, and USB interfaces into a single package using black epoxy resin — Its core advantage lies in balancing “performance (speed, lifespan)” with “cost,” positioning it between TLC black resin chips (high cost-effectiveness) and SLC black resin chips (high reliability). It caters to mid-to-high-end consumer-grade and entry-level industrial storage needs.

MLC (Multi-Level Cell) is one of the mainstream technologies for flash memory chips. Each storage cell can store 2 bits of data (corresponding to 4 voltage states). Compared to TLC (3 bits of data), it has lower storage density but simpler voltage control, resulting in advantages in read/write speed and endurance.
Compared to SLC (1-bit data), MLC offers lower costs and more competitive storage capacity, making it a “balanced” flash memory solution. Within the black gel structure, MLC chips serve as the core storage units, working in tandem with the controller chip to handle data writing, reading, and management. These components are then encapsulated in gel to form highly protective integrated modules.

Card-style USB drives do not necessarily require black gel encapsulation, but black gel technology remains the mainstream solution, particularly dominating ultra-thin, waterproof, and high-durability products.
Black gel encapsulation (UDP technology) integrates flash memory chips, controller chips, and USB interfaces into a single unit using epoxy resin gel. This eliminates solder joints and PCB boards, reducing thickness to 1.4-2mm (e.g., mUDP modules measure just 1.4mm thick). Key advantages include:


Ultra-slim design: Meets the ultra-thin requirements for card-style USB drives (e.g., business card USB drives at just 1.5mm thick);

Robust protection: IPX7 waterproof, dustproof, and shockproof, withstanding 1-meter drops;
High stability: Eliminates contact issues caused by component loosening in traditional soldered USB drives.
Traditional packaging (PCB board soldering) uses a separate PCB board to solder chips and interfaces, typically 3-5mm thick. Its advantages include:
Lower cost: Simple manufacturing process, suitable for low-cost promotional USB drives;
Easy maintenance: Damaged chips or interfaces can be replaced.

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